Patent · US Active

Method for applying magnetic shielding layer, method for manufacturing a die, die and system

US9583444B2 · kind B2 · utility

0Cited by

0References

25Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Christian Peters · Mountain View, US
Robert Allinger · Unterhaching, DE
Klaus Knobloch · Radeberg, DE
Snezana Jenei · Munich, DE

Key dates

Filing date	Aug 20, 2013
Grant date	Feb 28, 2017
Priority date	—
Expiry date	Aug 20, 2033

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T156/12
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A method for applying a magnetic shielding layer to a substrate is provided, wherein a first magnetic shielding layer is adhered to a first surface of the substrate. A first film layer is adhered to the first magnetic shielding layer and the first magnetic shielding layer is more adherent to the first surface than the film layer to the first magnetic shielding layer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.