Fan out system in package and method for forming the same
US9583472B2 · kind B2 · utility
19Cited by
7References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 3, 2015 |
| Grant date | Feb 28, 2017 |
| Priority date | — |
| Expiry date | Mar 3, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3511
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Packages and methods of formation are described. In an embodiment, a system in package (SiP) includes first and second redistribution layers (RDLs), stacked die between the first and second RDLs, and conductive pillars extending between the RDLs. A molding compound may encapsulate the stacked die and conductive pillars between the first and second RDLs.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.