Apparatus and method for drying substrate
US9587880B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 30, 2013 |
| Grant date | Mar 7, 2017 |
| Priority date | — |
| Expiry date | Feb 28, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67034
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
Provided is an apparatus and method for drying a substrate. The apparatus includes a housing, a substrate support member, a fluid supply member, and a discharge member. The housing provides a space in which a drying process is performed. The substrate support member is provided in the housing to support the substrate. The fluid supply member includes a supply line for supplying a process fluid of a supercritical state to the housing. The discharge member includes a discharge line for discharging the process fluid from the housing. Here, the supply line includes a first supply line provided to supply the process fluid to the housing at a first supply flow rate, and a second supply line provided to supply the process fluid to the housing at a second supply flow rate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.