Process for forming metal film, and product equipped with metal film
US9593423B2 · kind B2 · utility
1Cited by
2References
12Claims
0Family size
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Inventors
Key dates
| Filing date | Mar 18, 2014 |
| Grant date | Mar 14, 2017 |
| Priority date | — |
| Expiry date | Mar 15, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31678
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The purpose of the present invention is to provide a wiring substrate from which a metal film cannot be detached easily. A process for forming a metal film comprises a step (X) of applying an agent containing a compound (α) onto the surface of a base and a step (Y) of forming a metal film on the surface of the compound (α) by a wet-mode plating technique, wherein the compound (α) is a compound having either an OH group or an OH-generating group, an azide group and a triazine ring per molecule, and the base comprises a polymer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.