Apparatus and methods for manufacturing semiconductor devices and treating substrates
US9595434B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 5, 2015 |
| Grant date | Mar 14, 2017 |
| Priority date | — |
| Expiry date | May 5, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/78
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of manufacturing a semiconductor device includes: forming a pattern on a surface of a semiconductor substrate; placing the substrate on a platform of a substrate treatment apparatus; rotating the wafer while applying a cleaning liquid from a first nozzle and a wetting liquid from a second nozzle to treat a first region on the surface of the substrate; vertically changing the distance of the second nozzle together with the first nozzle with respect to the platform; after the vertical change, rotating the wafer while applying the cleaning liquid from the first nozzle and the wetting liquid from the second nozzle to treat a second region on the surface of the substrate; and forming a semiconductor device from the treated substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.