Methods of processing substrates
US9595446B2 · kind B2 · utility
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12References
20Claims
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Assignee
Inventors
Key dates
| Filing date | Jan 9, 2014 |
| Grant date | Mar 14, 2017 |
| Priority date | — |
| Expiry date | Jan 9, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15311
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Methods processing substrates are provided. The method may include providing a bonding layer between a substrate and a carrier to bond the substrate to the carrier, processing the substrate while the substrate is supported by the carrier, and removing the bonding layer to separate the substrate from the carrier. The bonding layer may include a thermosetting glue layer and thermosetting release layers provided on opposing sides of the thermosetting glue layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.