Manufacturing method for component incorporated substrate and component incorporated substrate manufactured using the method
US9596765B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 11, 2012 |
| Grant date | Mar 14, 2017 |
| Priority date | — |
| Expiry date | Apr 1, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/063
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A manufacturing method for a component incorporated substrate according to the present invention includes positioning an electronic component with reference to a mark formed on a copper layer, the mark consisting of a material less easily etched than copper by a copper etching agent used for etching of copper, after mounting the electronic component on the copper layer with an adhesive layer interposed therebetween, embedding the electronic component and the mark in an insulating substrate, thereafter, etching and removing a part of the copper layer to form a window for exposing the mark, forming an LVH reaching a terminal of the electronic component with reference to the exposed mark, electrically connecting the terminal and the copper layer via a conduction via formed by applying copper plating to the LVH, and, thereafter, forming the copper layer into a wiring pattern.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.