Selective nitride slurries with improved stability and improved polishing characteristics
US9597768B1 · kind B1 · utility
3Cited by
0References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 9, 2015 |
| Grant date | Mar 21, 2017 |
| Priority date | — |
| Expiry date | Sep 9, 2035 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08K2003/2213
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The invention provides a chemical-mechanical polishing composition comprising, consisting essentially of, or consisting of (a) about 0.01 wt. % to about 1 wt. % of wet-process ceria, (b) about 10 ppm to about 200 ppm of a cationic polymer comprising quaternary amino groups, (c) about 10 ppm to about 2000 ppm of a non-fluorinated nonionic surfactant, (d) an amino acid, and (e) water, wherein the polishing composition has a pH of about 3 to about 8. The invention further provides a method of polishing a substrate with the polishing composition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.