Method of filling through-holes
US9598787B2 · kind B2 · utility
3Cited by
13References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 14, 2013 |
| Grant date | Mar 21, 2017 |
| Priority date | — |
| Expiry date | May 15, 2034 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C18/1653
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The methods inhibit or reduce dimpling and voids during copper electroplating of through-holes with flash copper layers in substrates such as printed circuit boards. An acid solution containing reaction products of aromatic heterocyclic nitrogen compounds and epoxy-containing compounds is applied to the through-holes of the substrate followed by filling the through-holes with copper using a copper electroplating bath which includes additives such as brighteners and levelers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.