Electroplating apparatus with contact ring deplating
US9598788B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 25, 2013 |
| Grant date | Mar 21, 2017 |
| Priority date | — |
| Expiry date | Jul 3, 2035 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D21/00
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An electroplating apparatus has a rotor in a head, with a contact ring on the rotor. A lift/rotate actuator may move the head to position a sector of the contact ring into a deplate channel of a deplating station. Electrical current and a deplate liquid are applied directly onto the contacts of the contact ring, from a position radially inward of the contacts. Electrical current and a deplate liquid may also be separately applied onto the back side of the ring contact, from a position radially to the outside of the contact ring. A seal on the deplating station makes sliding contact with the contact ring as the contact ring rotates through the deplate channel, with the seal associated with an exhaust or vacuum opening that pulls deplating and rinse liquid through openings in the contact ring.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.