Method for preventing die pad delamination
US9601414B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 14, 2015 |
| Grant date | Mar 21, 2017 |
| Priority date | — |
| Expiry date | Dec 14, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/35121
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The invention is directed to a method for inhibiting or preventing delamination at the interface of the die attach/mold compound and the die pad of a semiconductor device and a semiconductor device formed by such method. The method includes providing a leadframe having a top surface; coating the top surface of the leadframe with first and second silane coating; heating the silane coatings to form a porous layer having a porosity of at least 10%; applying a die to the porous layer; securing the die to the porous layer by a die attaching compound; and after the curing of die attach material and wire bonding, a mold compound is applied through molding.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.