Patent · US Active

Package on package (POP) device comprising solder connections between integrated circuit device packages

US9601472B2 · kind B2 · utility

5Cited by

2References

20Claims

0Family size

Assignee

QUALCOMM Incorporated · US

Inventors

Lizabeth Keser · Chandler, US
David Fraser Rae · San Diego, US

Key dates

Filing date	Aug 27, 2015
Grant date	Mar 21, 2017
Priority date	—
Expiry date	Aug 27, 2035

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/15311
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Some features pertain to a package on package (PoP) device that includes a first package, a first solder interconnect coupled to the first integrated circuit package, and a second package coupled to the first package through the first solder interconnect. The second package includes a first die, a package interconnect comprising a first pad, where the first solder interconnect is coupled to the first pad of the package interconnect. The second package also includes a redistribution portion coupled to the first die and the package interconnect, an encapsulation layer at least partially encapsulating the first die and the package interconnect. The first pad may include a surface that has low roughness. The encapsulation layer may encapsulate the package interconnect such that the encapsulation layer encapsulates at least a portion of the first solder interconnect.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.