Methods for surface attachment of flipped active components
US9603259B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Aug 7, 2015 |
| Grant date | Mar 21, 2017 |
| Priority date | — |
| Expiry date | Aug 7, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1039
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An active substrate includes a plurality of active components distributed over a surface of a destination substrate, each active component including a component substrate different from the destination substrate, and each active component having a circuit and connection posts on a process side of the component substrate. The connection posts may have a height that is greater than a base width thereof, and may be in electrical contact with the circuit and destination substrate contacts. The connection posts may extend through the surface of the destination substrate contacts into the destination substrate connection pads to electrically connect the connection posts to the destination substrate contacts.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.