Apparatus for mounting semiconductor chips
US9603294B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 13, 2012 |
| Grant date | Mar 21, 2017 |
| Priority date | — |
| Expiry date | Mar 10, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53178
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus includes a pick and place system with a bonding head, picking head and support table. The picking head and support table are mounted on a carriage. The apparatus can be operated in a direct mode and a parallel mode. In the direct mode the carriage is in a first position (parked). A control unit operates the pick and place system to cause the bonding head to move a series of semiconductor chips from the wafer table to the substrate. In the parallel mode, the carriage is in a second position. The control unit operates the picking head, support table and pick and place system to repeatedly cause the picking head to move a semiconductor chip from the wafer table to the support table and the bonding head to move said semiconductor chip from the support table to the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.