Alignment apparatus
US9607389B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Sep 17, 2015 |
| Grant date | Mar 28, 2017 |
| Priority date | — |
| Expiry date | Sep 17, 2035 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06T2207/30204
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
An alignment apparatus for aligning a wafer by optically detecting an alignment mark includes an imaging unit configured to image an imaging region extending across a circumferential edge of the wafer, an irradiation unit configured to irradiate light toward the imaging region, a reflection part configured to reflect toward the imaging region the light that is irradiated from the irradiation unit upwardly, and a control unit configured to detect the circumferential edge. The reflection part has a reflectance making a luminance difference between the outside of the wafer and the circumferential edge of the wafer in a luminance distribution pattern obtained by imaging the imaging region. The control unit detects the alignment mark and the circumferential edge based on the luminance distribution pattern.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.