Apparatus and operation method thereof
US9607873B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 7, 2014 |
| Grant date | Mar 28, 2017 |
| Priority date | — |
| Expiry date | Apr 26, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67389
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus includes a body and a surface for receiving a semiconductor wafer carrier is provided. A nozzle and a venting hole are provided on the surface. The semiconductor wafer carrier has at least one selectively closable capped opening at a bottom, top and/or side surface thereof. The capped opening is configured to couple to, and be accessible by, the nozzle and receive gas output from the nozzle so as to create a substantially oxygen free environment within the semiconductor wafer carrier. The vent hole is configured to allow gas to flow out of the semiconductor wafer carrier. In addition, the apparatus includes a sensor and a controller. The sensor is configured to monitor an ambient condition in the semiconductor wafer carrier, and the controller is configured to adjust a control valve based on the ambient condition so as to control the gas flow or output from the nozzle.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.