Method and circuits for communication in multi-die packages
US9607948B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 31, 2015 |
| Grant date | Mar 28, 2017 |
| Priority date | — |
| Expiry date | Apr 21, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Various example implementations are directed to circuits and methods for inter-die communication on a multi-die integrated circuit (IC) package. According to an example implementation, an IC package includes a first semiconductor die having a plurality of communication circuits for communicating data over respective data terminals of the package. The package also includes a second semiconductor die having N contacts for communicating data to and from the semiconductor die. The second semiconductor die includes a logic circuit configured to communicate M parallel data signals with one or more other semiconductor dies of the package, wherein M>N. The second semiconductor die also includes a plurality of serializer circuits, each configured to serialize data from a respective subset of the plurality of the M signal lines to produce serialized data and provide the serialized data to a respective one of the contacts.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.