Packaging device having plural microstructures disposed proximate to die mounting region
US9607959B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 27, 2014 |
| Grant date | Mar 28, 2017 |
| Priority date | — |
| Expiry date | Dec 18, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0541
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An example packaging device includes a substrate having an integrated circuit die mounting region disposed thereon. A plurality of microstructures are disposed proximate a side of the integrated circuit die mounting region. The plurality of microstructures each include an outer insulating layer over a conductive material. An example packaged semiconductor device includes a substrate having an integrated circuit die mounting region disposed thereon. A plurality of columnar microstructures are disposed on the substrate perpendicular to a major surface of the substrate and proximate a side of the integrated circuit die mounting region. An underfill material is disposed between the substrate and the integrated circuit die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.