Highly crosslinked polymer dielectric films for improved capacitor performance
US9611346B2 · kind B2 · utility
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Key dates
| Filing date | May 30, 2014 |
| Grant date | Apr 4, 2017 |
| Priority date | — |
| Expiry date | Dec 13, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31855
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
New polymeric dielectric materials are provided for high power capacitors, especially for mobile and weapons applications. These materials utilize aminoplast crosslinking in their polymeric structure. The aminoplast crosslinking ability of these materials allows them to be customized for a number of applications, but also allows the materials to have a higher crosslinking density, leading to higher dielectric constants, higher breakdown voltage, and higher thermal stability. These materials can be incorporated into current capacitor manufacturing schemes with little to no processing changes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.