Ultra-broadband photonic integrated circuit platform and ultra-broadband photonic integrated circuit
US9612398B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 16, 2015 |
| Grant date | Apr 4, 2017 |
| Priority date | — |
| Expiry date | Oct 16, 2035 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/12011
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An ultra-broadband photonic integrated circuit platform that combines at least two types of waveguides that each transmit in different, but overlapping, spectral bands on a single chip. By combining the multiple waveguides, the bandwidth of the platform can be extended beyond the bandwidth of either waveguide alone. In an exemplary embodiment, an ultra-broadband photonic integrated circuit includes a nitride-on-insulator (NOI) waveguide configured to transmit optical beams in a first spectral band and a silicon-on-nitride-on-insulator (SONOI) waveguide configured to transmit optical beams in a second band, where the same material serves as the core material in the NOI waveguide and as the cladding material in the SONOI waveguide. In some embodiments, light-emitting devices are bonded to an upper surface of the waveguides. In some embodiments, the circuit includes beam-combining elements so that a single beam combining all of the input wavelengths is output from the circuit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.