Method of flip-chip assembly of two electronic components by UV annealing, and assembly obtained
US9613924B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 1, 2014 |
| Grant date | Apr 4, 2017 |
| Priority date | — |
| Expiry date | Jul 1, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/014
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The invention concerns a method of flip-chip assembly between first (1) and second (2) components each comprising connection pads (11, 21) on one of the faces of same, referred to as assembly faces, which involves transferring the components onto each other via the assembly faces of same in such a way as to create electrical interconnections between the pads of the first and second components. The invention involves transforming the copper oxide into copper by UV annealing, very locally, in the gap between the components, at least around the areas adjacent to the connection pads. The method according to the invention can be used for any component that is transparent to UV rays, including for substrates made from a plastic material such as substrates made from PEN or PET. The invention also concerns the assembly of two components obtained by the method.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.