Amelie Revaux
5Patents
1h-index
4Co-inventors
36Inventor score
Filing activity: Jul 1, 2014 → Dec 16, 2019
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9613924B2 | Method of flip-chip assembly of two electronic components by UV annealing, and assembly obtained | Electricity | 7 | Active |
| US11237058B2 | Thermal pattern sensor with pyroelectric capacitance | Physics | 0 | Active |
| US11101423B2 | Method of manufacturing a device comprising a material acquiring an electrical property after have been subjected to an electric polarisation | Electricity | 0 | Active |
| US10580956B2 | Method for producing a stack of layers for a matrix thermal sensor | Physics | 0 | Active |
| US11073426B2 | Pyroelectric sensor with improved abrasion-resistance coating | Physics | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.