Method and apparatus for chip-to-wafer integration
US9613928B2 · kind B2 · utility
0Cited by
3References
18Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 16, 2014 |
| Grant date | Apr 4, 2017 |
| Priority date | — |
| Expiry date | Jul 16, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2225/06593
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus and a method for chip-to-wafer integration is provided. The apparatus includes a coating module, a bonding module and a cleaning module. The method includes the steps of placing at least one chip on a wafer to form an integrated product, forming a film on the integrated product, such that the integrated product is substantially fluid-tight, and exerting a predetermined positive pressure on the film during permanent bonding of the at least one chip to the wafer. The method further includes the step of removing the film from the integrated product after permanent bonding of the at least one chip to the wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.