Electronic component, process for producing same, sealing material paste, and filler particles
US9614178B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 9, 2013 |
| Grant date | Apr 4, 2017 |
| Priority date | — |
| Expiry date | Oct 9, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E10/50
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
In an electronic component including two substrates at least one of which is transparent, an organic member arranged between these substrates, and a bonding portion located onto respective outer circumferential portions of the two substrates, this bonding portion includes a low-melting glass and filler particles. The low-melting glass includes vanadium oxide. The filler particles include a low thermally-expandable material, and an oxide containing a bivalent transition metal as a constituent element. The oxide is dispersed in the low thermally-expandable material, and the low thermally-expandable material has a thermal expansion coefficient of 5×10−7/° C. or less in a temperature range from 30 to 250° C. This invention makes it possible to heat the filler particles by irradiation with a laser to give the electronic component which is a component having a highly reliable bonding portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.