Chemical mechanical planarization pad conditioner
US9616547B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 20, 2015 |
| Grant date | Apr 11, 2017 |
| Priority date | — |
| Expiry date | Aug 20, 2035 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B53/017
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A pad conditioner for a CMP polishing pad is disclosed that includes a substrate that has a matrixical arrangement of protrusions that have a layer of poly crystalline diamond on at least their top surfaces. The protrusions may have varying shapes and elevations and may comprise a first set of protrusions and a second set of protrusions, the first set of protrusions have a first average height and the second set of protrusions have a second average height, the first average height different from the second average height, a top of each protrusion in the first set of protrusions has a non-flat surface and a top of each protrusion in the second set of protrusions has a non-flat surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.