Stiffener tape for electronic assembly that includes wafer or panel
US9620404B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 9, 2015 |
| Grant date | Apr 11, 2017 |
| Priority date | — |
| Expiry date | Dec 9, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/562
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A stiffener tape for a wafer. The stiffener tape includes a mounting tape; a heat spreading stiffener removably attached to the mounting tape; and an attachment film secured to the heat spreading stiffener, wherein the attachment film includes thermal conductive fillers having at least one of silver, alumina, crystalline silica, boron nitride or aluminum nitride. An electronic assembly includes a wafer; a plurality of integrated circuits on the wafer; and an attachment film covering the plurality of integrated circuits and the substrate, wherein the attachment film includes thermal conductive fillers having at least one of silver, alumina, crystalline silica, boron nitride or aluminum nitride; and a heat spreading stiffener secured to the attachment film.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.