Wireless communications package with integrated antennas and air cavity
US9620464B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 20, 2015 |
| Grant date | Apr 11, 2017 |
| Priority date | — |
| Expiry date | Jul 20, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10515
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
Antenna package structures are provided to implement wireless communications packages. For example, an antenna package includes a package carrier and a package cover. The package carrier includes an antenna ground plane and an antenna feed line. The package cover includes a planar lid having a planar antenna element formed on a first surface of the planar lid. The package cover is bonded to a first surface of the package carrier with the first surface of the planar lid facing the first surface of the package carrier, and with the planar antenna element aligned to the antenna ground plane and the antenna feed line of the package carrier, wherein the first surface of the planar lid is disposed at a distance from the first surface of the package carrier to provide an air space between the planar antenna element and the package carrier.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.