Quilt packaging system with interdigitated interconnecting nodules for inter-chip alignment

US9620473B1 · kind B1 · utility

Assignee

• University of Notre Dame du Lac · US

Inventors

• Douglas C. Hall · South Bend, US
• Scott Howard · South Bend, US
• Anthony Hoffman · South Bend, US
• Gary H. Bernstein · Granger, US
• Jason M. Kulick · South Bend, US

Key dates

• Filing date: Jan 17, 2014
• Grant date: Apr 11, 2017
• Expiry date: Jan 17, 2034

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2224/175
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

First and second integrated devices each have an optical component and a plurality of interconnect structures disposed one edge thereon. The first edge surface of the second integrated device is positioned contiguous to the first edge surface of the first integrated device. The interconnect structures disposed on the first integrated device are in physical contact with the interconnect structures disposed on the edge surface of the second integrated device so as to provide alignment for conveying at least one signal between the optical components on the first and second integrated devices.