Anthony Hoffman
3Patents
1h-index
4Co-inventors
30Inventor score
Filing activity: Jan 17, 2014 → Apr 21, 2017
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9620473B1 | Quilt packaging system with interdigitated interconnecting nodules for inter-chip alignment | Electricity | 7 | Active |
| US10410989B2 | Inter-chip alignment | Emerging Cross-Sectional Technologies | 1 | Active |
| US10050027B2 | Quilt packaging system with mated metal interconnect nodules and voids | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.