Semiconductor structure with micro-electro-mechanical system devices
US9624092B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 29, 2016 |
| Grant date | Apr 18, 2017 |
| Priority date | — |
| Expiry date | Jan 29, 2036 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C2203/0778
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A semiconductor structure having micro-electro-mechanical system (MEMS) devices is provided. One of the MEMS devices includes a substrate having a first region and a second region; a membrane structure formed in the first region and positioned correspondingly to a cavity of the substrate; a logic device formed in the second region, and electrically connected to the membrane structure; an interconnection structure formed in the second region, and the interconnection structure formed on the substrate and covering the logic device; and an etching stop layer formed in the second region, and the etching stop layer formed on the interconnection structure and including a nitride layer and a carbon-containing layer formed on the nitride layer. Also, a variation in resonant frequencies of the MEMS devices on the entire wafer is less than 10%.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.