Device, system and method for alignment of an integrated circuit assembly
US9625256B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 23, 2015 |
| Grant date | Apr 18, 2017 |
| Priority date | — |
| Expiry date | Dec 23, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Techniques and mechanisms for evaluating misalignment of circuit structures. In an embodiment, infrared (IR) radiation is variously focused on different planes of an assembly including an integrated circuit (IC) chip and a substrate that is to be coupled to, or that is coupled to, the IC chip. The cross-sectional planes include respective structures that variously reflect IR radiation. The reflected IR radiation is measured to create images each representing a corresponding cross-section of the assembly. In another embodiment, respective reference features of the images are identified and evaluated to determine whether a misalignment between the reference features satisfies one or more threshold test conditions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.