Patent · US Active

Exposure activated chemically amplified directed self-assembly (DSA) for back end of line (BEOL) pattern cutting and plugging

US9625815B2 · kind B2 · utility

0Cited by

3References

3Claims

0Family size

Assignee

Intel Corporation · US

Inventors

Paul A. Nyhus · Portland, US
Eungnak Han · Portland, US
Swaminathan Sivakumar · Portland, US
Ernisse Putna · Beaverton, US

Key dates

Filing date	Sep 27, 2013
Grant date	Apr 18, 2017
Priority date	—
Expiry date	Jan 24, 2034

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB81C2201/0149
WIPO fieldOptics
WIPO sectorInstruments

Abstract

Self-aligned via and plug patterning for back end of line (BEOL) interconnects are described. In an example, a structure for directed self-assembly includes a substrate and a block co-polymer structure disposed above the substrate. The block co-polymer structure has a polystyrene (PS) component and a polymethyl methacrylate (PMMA) component. One of the PS component or the PMMA component is photosensitive.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.