Substrate treating apparatus
US9627233B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 24, 2014 |
| Grant date | Apr 18, 2017 |
| Priority date | — |
| Expiry date | May 4, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67051
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Provided is a substrate treating apparatus including a housing; a plurality of opening-and-closing members configured to provide a driving force for opening and closing the housing; a fluid storing member supplying a fluid to the opening-and-closing members; and a fluid distribution unit connected to the fluid storing member via a supply conduit to distribute the fluid supplied from the fluid storing member to the opening-and-closing members. The fluid distribution unit includes a distribution conduit diverging from the supply conduit and connected to a corresponding one of the opening-and-closing members; and a fluid distribution member provided at a junction between the supply conduit and the distribution conduit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.