Method of making a wire support leadframe for a semiconductor device
US9627331B1 · kind B1 · utility
3Cited by
0References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 30, 2015 |
| Grant date | Apr 18, 2017 |
| Priority date | — |
| Expiry date | Dec 30, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/17747
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A leadframe includes a plurality of interconnected support members. A pair of die pads is connected to the support members and configured to receive a pair of dies electrically connected by at least one wire. A support bracket extends between the die pads and includes a surface for maintaining the at least one wire at a predetermined distance from the die pads during overmolding of the leadframe.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.