Integrated circuit structure and seal ring structure
US9627332B1 · kind B1 · utility
6Cited by
0References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 5, 2016 |
| Grant date | Apr 18, 2017 |
| Priority date | — |
| Expiry date | Feb 5, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/562
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit structure with seal ring structure is provided. The seal ring structure includes a low k dielectric layer, a first seal ring and a second seal ring. The first seal ring and the second seal ring are spaced from each other. Each of the first seal ring and the second seal ring comprises a metal layer. The metal layer is embedded in the low k dielectric layer, and the metal layer includes a body pattern having a plurality of openings. The area ratio of the body pattern to the metal layer of the first seal ring and the second seal ring is greater than or equal to 50% and less than 100%.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.