Methods of forming wafer level underfill materials and structures formed thereby
US9631065B2 · kind B2 · utility
1Cited by
6References
42Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 12, 2013 |
| Grant date | Apr 25, 2017 |
| Priority date | — |
| Expiry date | Jun 16, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Methods of forming microelectronic packaging structures and associated structures formed thereby are described. Those methods and structures may include forming a wafer level underfill (WLUF) material comprising a resin material, and adding at least one of a UV absorber, a sterically hindered amine light stabilizer (HALS), an organic surface protectant (OSP), and a fluxing agent to form the WLUF material. The WLUF is then applied to a top surface of a wafer comprising a plurality of die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.