Patent · US Active

Hybrid phase unwrapping systems and methods for patterned wafer measurement

US9632038B2 · kind B2 · utility

2Cited by

9References

21Claims

0Family size

Assignee

KLA-TENCOR CORPORATION · US

Inventors

Haiguang Chen · Millbrae, US
Jaydeep Sinha · Livermore, US

Key dates

Filing date	Jul 24, 2015
Grant date	Apr 25, 2017
Priority date	—
Expiry date	Oct 2, 2035

Classification

Technology area (CPC G)Physics
CPC primaryG06T2207/30148
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

Systems and methods for unwrapping phase signals obtained from interferometry measurements of patterned wafer surfaces are disclosed. A phase unwrapping method in accordance with the present disclosure may calculate a front surface phase map and a back surface phase map of a wafer, subtract the back surface phase map from the front surface phase map to obtain a phase difference map, unwrap the phase difference map to obtain a wafer thickness variation map, unwrap the back surface phase map to obtain a back surface map representing the back surface of the wafer; and add the wafer thickness variation map to the back surface phase map to calculate a front surface map representing the front surface of the wafer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.