Device for treating surfaces of wafer-shaped articles and gripping pin for use in the device
US9633890B2 · kind B2 · utility
0Cited by
11References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 16, 2011 |
| Grant date | Apr 25, 2017 |
| Priority date | — |
| Expiry date | May 31, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T279/17213
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A device for processing wafer-shaped articles comprises a rotary chuck having a series of pins adapted to hold a wafer shaped article on the rotary chuck. Each of the pins comprises a cylindrical body and a projecting gripping portion formed integrally therewith. The cylindrical body and gripping portion are made from a ceramic material. The gripping portion comprises cylindrical surfaces having a common generatrix with surfaces of the cylindrical body.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.