Method for forming a transistor structure comprising a fin-shaped channel structure
US9633891B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 28, 2015 |
| Grant date | Apr 25, 2017 |
| Priority date | — |
| Expiry date | Oct 28, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D62/115
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An example method includes providing a layer stack in a trench defined by adjacent STI structures and recessing the STI structures adjacent to the layer stack to thereby expose an upper portion of the layer stack, the upper portion comprising at least a channel portion. The method further includes providing one or more protection layers on the upper portion of the layer stack and then further recessing the STI structures selectively to the protection layers and the layer stack, to thereby expose a central portion of the layer stack. And the method includes removing the central portion of the layer stack, resulting in a freestanding upper part and a lower part of the layer stack being physically separated from each other.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.