Electronic device module and manufacturing method thereof
US9633923B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 23, 2014 |
| Grant date | Apr 25, 2017 |
| Priority date | — |
| Expiry date | Mar 20, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4913
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
There are provided an electronic device module capable of increasing a degree of integration by mounting electronic components on both surfaces of a board, and a manufacturing method thereof. The electronic device module includes a board having mounting electrodes formed on both surfaces thereof, a plurality of electronic devices mounted on the mounting electrodes, a molded portion sealing the electronic devices, at least one connection wire having one end bonded to one surface of the board and the other end exposed to the outside of the molded portion, and an external connection terminal coupled to the other end of the connection wire.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.