Patent · US Active

Integrated circuit die with corner IO pads

US9633959B2 · kind B2 · utility

0Cited by

7References

11Claims

0Family size

Assignee

Freeescale Semiconductor, Inc. · US

Inventors

Shailesh Kumar · San Diego, US
Vikas Garg · Delhi, IN
Meng Kong Lye · Shah Alam, MY

Key dates

Filing date	Feb 11, 2015
Grant date	Apr 25, 2017
Priority date	—
Expiry date	Mar 21, 2035

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2224/06179
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

An integrated circuit (IC) die has side input/output (IO) pads located along each side of the die interior. Each die corner has a corner IO pad. The side IO pads adjacent to the corner IO pads have shortened passivation regions in the top metal layer (TML) that define TML access regions. TML traces run through the TML access regions to connect the corner IO pads to the die interior. Providing corner IO pads enables an IC die to have up to four more IO pads than a comparable conventional IC die that does not have any corner IO pads, or an IC die to have the same number of IO pads within a smaller overall footprint.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.