Patent · US Active

System in package fan out stacking architecture and process flow

US9633974B2 · kind B2 · utility

39Cited by

4References

16Claims

0Family size

Assignee

Apple Inc. · US

Inventors

Jun Zhai · Cupertino, US
Kunzhong Hu · Cupertino, US
Kwan-Yu Lai · Campbell, US
Mengzhi Pang · Cupertino, US
Chonghua Zhong · Irvine, US
Se Young Yang · San Jose, US

Key dates

Filing date	Mar 4, 2015
Grant date	Apr 25, 2017
Priority date	—
Expiry date	Mar 4, 2035

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/19105
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Packages and methods of formation are described. In an embodiment, a system in package (SiP) includes first and second redistribution layers (RDLs), and a plurality of die attached to the front and back side of the first RDL. The first and second RDLs are coupled together with a plurality of conductive pillars extending from the back side of the first RDL to a front side of the second RDL.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.