Circuit board and manufacturing method thereof
US9635757B1 · kind B1 · utility
15Cited by
0References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 11, 2016 |
| Grant date | Apr 25, 2017 |
| Priority date | — |
| Expiry date | Aug 11, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0557
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A circuit board and a manufacturing method thereof are provided. The circuit board includes a dielectric substrate, a circuit pattern and a dielectric layer. The circuit pattern is disposed on the dielectric substrate. The dielectric layer is disposed on the dielectric substrate and covers the circuit pattern. The dielectric layer includes a dielectric matrix and a mesh-shaped fiber structure disposed in the dielectric matrix. There is no mesh-shaped fiber structure on a portion of the dielectric substrate exposed by the circuit pattern.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.