Patent · US Active

Gyro MEMS sensor package

US9637376B2 · kind B2 · utility

0Cited by

5References

20Claims

0Family size

Assignee

Technology Partners LLC · GB

Inventors

Kelvin Po Leung Pun · Sha Tin, CN
Chee Wah Cheung · Sha Tin, CN

Key dates

Filing date	Apr 20, 2016
Grant date	May 2, 2017
Priority date	—
Expiry date	Apr 20, 2036

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/181
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

An integrated circuit packaging structure comprises at least one Micro Electrical Mechanical Systems (MEMS) gyroscope die mounted directly on a multi-layer flexible substrate having at least one metal layer and wire-bonded to the flexible substrate and a lid or die coating protecting the MEMS die and wire bonds.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.