Photonic sintering of a solderable polymer thick film copper conductor composition
US9637648B2 · kind B2 · utility
0Cited by
5References
11Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Sep 23, 2015 |
| Grant date | May 2, 2017 |
| Priority date | — |
| Expiry date | Jan 12, 2036 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08K2201/001
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
This invention provides a polymer thick film copper conductor composition for forming a solderable and highly solder leach resistant electrical conductor and a method for using the polymer thick film copper conductor composition to form the electrical conductor in an electrical circuit. The method subjects the deposited thick film copper conductor composition to photonic sintering. The invention further provides electrical devices containing electrical conductors made from the polymer thick film copper conductor composition and also those formed by the method.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.