Etching apparatus and methods
US9640370B2 · kind B2 · utility
1Cited by
3References
12Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 4, 2014 |
| Grant date | May 2, 2017 |
| Priority date | — |
| Expiry date | Feb 4, 2035 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C2201/0142
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A method is for etching the whole width of a substrate to expose buried features. The method includes etching a face of a substrate across its width to achieve substantially uniform removal of material; illuminating the etched face during the etch process; applying edge detection techniques to light reflected or scattered from the face to detect the appearances of buried features; and modifying the etch in response to the detection of the buried feature. An etching apparatus for etching substrate across its width to expose buried is also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.