Robust ink formulations for durable markings on microelectronic packages and its extendibility as a barrier material for thermal and sealant materials
US9640415B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 1, 2014 |
| Grant date | May 2, 2017 |
| Priority date | — |
| Expiry date | Dec 3, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Methods for covalently and indelibly anchoring a polyacrylate polymer using a UV-induced polymerization process in the presence of a photoinitiator to an oxide surface are disclosed herein. The methods and compositions prepared by the methods can be used as indelible marking materials for use on microelectronic packages and as solder and sealant barriers to prevent overspreading of liquids on the oxide surfaces of microelectronic packages. The polyacrylate polymers are covalently linked to the oxide surface by use during the printing and UV-curing process of an adhesion promoter having as a first domain an oxide-reactive silyl group, bonded via a linker to an acrylate-reactive group.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.