Built-up lead frame package and method of making thereof

US9640463B2 · kind B2 · utility

Assignee

• Nexperia B.V. · NL

Inventors

• Kan Wae Lam · Sha Tin, CN
• Pompeo V. Umali · Kwai Chung, CN
• Chi Ho Leung · Kowloon, CN
• Shun Tik Yeung · Kwai Chung, CN
• Chi Ling Shum · Kwai Chung, CN

Key dates

• Filing date: Jun 22, 2015
• Grant date: May 2, 2017
• Expiry date: Jun 22, 2035

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/13091
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

Consistent with an example embodiment, a semiconductor device comprises a device die having bond pads providing connection to device die circuitry. The semiconductor device includes a built-up substrate lead frame having, a sub-structure of I/O terminals and a die attach area, the I/O terminals and die attach area enveloped in a molding compound, the die attach area having exposed areas to facilitate device die attachment thereon and the terminal I/O terminals providing connection to the device die bond pads; connection traces electrically couple the I/O terminals with one another, said connection traces having facilitated electroplating of exposed vertical surfaces of the I/O terminals during assembly, said connection traces being severed after assembly. An envelope of molding compound encapsulates the device die onto the built-up substrate lead frame.