Laminate warpage control
US9640492B1 · kind B1 · utility
0Cited by
9References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 17, 2015 |
| Grant date | May 2, 2017 |
| Priority date | — |
| Expiry date | Dec 17, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3511
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A laminate includes a core, a buildup layer having a top and a bottom, the bottom contacting the core and a solder mask contacting the top, the solder mask including at least one warpage control region formed on a top surface of the solder mask.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.