Integrated fan-out (InFO) package structures and methods of forming same
US9640498B1 · kind B1 · utility
17Cited by
12References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 20, 2015 |
| Grant date | May 2, 2017 |
| Priority date | — |
| Expiry date | Oct 20, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3511
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An embodiment method includes providing a carrier having a recess and attaching a die to the carrier, wherein the die is at least partially disposed in the recess. The method further includes forming a molding compound over the carrier and around at least a portion of the die, forming fan-out redistribution layers over the molding compound and electrically connected to the die, and removing the carrier.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.